2 Layer OSP F4B High Igbohunsafẹfẹ PCB
About F4B High Igbohunsafẹfẹ PCB
Wangling F4B da lori awọn ibeere iṣẹ ṣiṣe itanna ti awọn iyika makirowefu,
O ti wa ni a irú ti o tayọ makirowefu tejede Circuit ọkọ pẹlu ti o dara itanna-ini ati ki o ga darí agbara.
Apẹrẹ Of F4B High Igbohunsafẹfẹ PCB
Ninu apẹrẹ ti PCB-igbohunsafẹfẹ giga, awọn apẹẹrẹ nigbagbogbo san ifojusi diẹ sii si igbagbogbo dielectric (DK) ati isonu tangent (DF) ti PCB nigbati o ba yan awọn ohun elo, ati ki o san ifojusi si sisanra ti bankanje bàbà nigbati o yan bankanje bàbà, eyiti o jẹ. rọrun lati foju ipa ti awọn oriṣiriṣi oriṣi ti roughness Ejò bankanje lori awọn ohun-ini itanna ti awọn ọja.
Ayẹwo SEM ti micromorphology ti awọn oriṣiriṣi oriṣi ti bankanje bàbà ati dada olubasọrọ dielectric fihan pe roughness ti awọn oriṣiriṣi oriṣi ti bankanje bàbà jẹ ohun ti o yatọ.Ni awọn oniru ti microstrip ila, awọn roughness ti Ejò bankanje ati dielectric olubasọrọ dada yoo taara ni ipa awọn ifibọ isonu ti gbogbo gbigbe ila.
Ohun elo paramita Of F4B PCB
Wangling F4B jẹ ti awọn ohun elo didara ni ibamu si awọn ibeere iṣẹ ṣiṣe itanna ti awọn iyika makirowefu.O ni iṣẹ itanna to dara ati agbara ẹrọ giga.O ti wa ni ẹya o tayọ makirowefu tejede Circuit subgrade ọkọ.Deede 15N / cm ibakan ọririn ooru ati 260 ℃ ± 2℃ fusion alurinmorin ohun elo lati tọju 20 aaya lai foomu, ko si stratification ati peeling agbara ≥12 N / cm.
| Iru ohun elo | Awoṣe | Ohun elo kikun | Dk (@10GHZ) | Df (@10GHZ) |
| F4B-1/2 | PTFE + Aṣọ gilasi | 2.55 / 2.65 | ≤0.001 | |
| F4BK | F4BK225 | PTFE + Aṣọ gilasi | 2.55 | ≤0.001 |
| F4BK265 | PTFE + Aṣọ gilasi | 2.65 | ≤0.001 | |
| F4BK300 | PTFE + Aṣọ gilasi | 3 | ≤0.001 | |
| F4BK350 | PTFE + Aṣọ gilasi | 3.5 | ≤0.001 | |
| F4BM | F4BM220 | PTFE + Aṣọ gilasi | 2.2 | ≤0.007 |
| F4BM225 | PTFE + Aṣọ gilasi | 2.55 | ≤0.007 | |
| F4BM265 | PTFE + Aṣọ gilasi | 2.65 | ≤0.007 | |
| F4BM300 | PTFE + Aṣọ gilasi | 3 | ≤0.007 | |
| F4BM350 | PTFE + Aṣọ gilasi | 3.5 | ≤0.007 |
